LED module

ABSTRACT

An LED module 100 includes LED chips 21, 22 spaced apart from each other, and an LED chip 23 offset from a straight line connecting the LED chips 21 and 22 and located between the LED chips 21, 22 in the direction in which the LED chips 21, 22 are spaced. The module further includes a lead 31 with a bonding portion 31a and a mounting terminal surface 31d, a lead 32 with a bonding portion 32a and a mounting terminal surface 32d, and a lead 33 with a bonding portion 33a and a mounting terminal surface 33d. The mounting terminal surfaces 31d, 32d, 33d are flush with each other. Light from the LED chips 21, 22, 23 is emitted in the direction in which the mounting terminal surfaces 31d, 32d and 33d extend. Thus, light of different colors properly mixed can be emitted from a compact LED module.

TECHNICAL FIELD

The present invention relates to an LED module of a so-called side-viewtype.

BACKGROUND ART

FIG. 7 shows an example of a conventional LED module. The LED module 900illustrated in the figure includes leads 91A and 91B, an LED chip 92,and a case 93 and is configured as a so-called side-view type. The leads91A and 91B each comprises a plate made of e.g. an alloy of Cu or Niplated with Ag. The LED chip 92 is mounted on the lead 91A. The LED chip92 is configured to emit e.g. blue light. The LED chip 92 and the lead91B are connected to each other with a wire 95. The case 93 is made ofe.g. white resin and surrounds the four sides of the LED chip 92.Portions of the leads 91A and 91B that are exposed from the case 93serve as mounting terminals 91Aa and 91Ba. The space surrounded by thecase 93 is filled with light-transmitting resin, not shown. Thelight-transmitting resin is made of e.g. a transparent resin mixed witha fluorescent substance. The fluorescent substance emits e.g. yellowlight when excited by the light emitted from the LED chip 92. The bluelight from the LED chip 92 and the yellow light from the fluorescentsubstance mix with each other, so that white light is emitted from theLED module 900.

One of the means for increasing the application of the LED module 900 isto configure the LED module to emit light of a plurality of colors,instead of a single color. For this purpose, it is necessary to providea plurality of LED chips 92 that emit light of different wavelengthsfrom each other. However, in the LED module 900 of a side-view type, theheight (the dimension in the vertical direction in the figure) is oftenlimited to a certain value. Thus, it is desirable to arrange the LEDchips 92 as close to each other as possible. Further, when the LED chips92 are too far away from each other, light of different colors cannotsufficiently mix with each other when all the LED chips 92 are turnedon.

Patent Document: JP-A-2006-253551

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

The present invention has been conceived in view of the foregoingsituation. It is therefore an object of the present invention to providean LED module that is configured to properly mix light of a plurality ofcolors for emission and that can be made compact.

Means for Solving the Problems

An LED module provided according to a first aspect of the presentinvention comprises: at least one LED chip; at least one lead includinga bonding portion on which the LED chip is mounted and a mountingterminal surface for surface mounting; and a case covering a part of thelead. Light from the LED chip is emitted in the direction in which themounting terminal surface extends. In an embodiment, the LED moduleincludes a first and a second LED chips spaced apart from each other,and a third LED chip arranged at a position that is offset from astraight line connecting the first and the second LED chips, where theabove-mentioned position is between the first LED chip and the secondLED chip in a spacing direction in which the first and the second LEDchips are spaced apart from each other.

In another embodiment according to a first aspect of the presentinvention, there is provided an LED module comprises: a first and asecond LED chips spaced apart from each other; a third LED chip arrangedat a position that is offset from a straight line connecting the firstand the second LED chips, the above-mentioned position being between thefirst LED chip and the second LED chip in a spacing direction in whichthe first and the second LED chips are spaced apart from each other; afirst lead including a first bonding portion on which the first LED chipis mounted and a first mounting terminal surface for surface-mounting; asecond lead including a second bonding portion on which the second LEDchip is mounted and a second mounting terminal surface forsurface-mounting; and a third lead including a third bonding portion onwhich the third LED chip is mounted and a third mounting terminalsurface for surface-mounting. The first through the third mountingterminal surfaces are flush with each other, and light from each of thefirst through the third LED chips is emitted in a direction in which thefirst through the third mounting terminal surfaces extend.

According to a second aspect of the present invention, in the LED moduleof the first aspect, one of the first and the second LED chips emitsblue light, the other one of the first and the second LED chips emitsgreen light, and the third LED chip emits red light.

According to a third aspect of the present invention, the LED module ofthe second aspect further comprises a third wire including an end bondedto the third LED chip and extending across the straight line connectingthe first and the second LED chips.

According to a fourth aspect of the present invention, the LED module ofthe second or third aspect further comprises a first wire including anend bonded to the first LED chip and extending away from the third LEDchip in the spacing direction.

According to a fifth aspect of the present invention, in the LED moduleof any one of the first through fourth aspects, the third lead comprisesa detour portion extending in the spacing direction and passing at leastone of the first and the second LED chips, where the detour portion isprovided between the third bonding portion and the third mountingterminal surface.

According to a sixth aspect of the present invention, in the LED moduleof any one of the first through fifth aspects, the first lead comprisesa first wire bonding portion to which another end of the first wire isbonded and a groove positioned between the first bonding portion and thefirst wire bonding portion.

According to a seventh aspect of the present invention, the LED moduleof any one of the first through sixth aspects further comprises a Zenerdiode arranged opposite to the third LED chip with respect to the firstLED chip in the spacing direction, where the Zener diode is connected inseries to the first LED chip.

According to an eighth aspect of the present invention, the LED moduleof any one of the first through seventh aspects further comprises: afirst additional wire including an end bonded to the first LED chip; afourth lead including a fourth wire bonding portion to which another endof the first additional wire is bonded and also including a fourthmounting terminal surface for surface mounting; a second additional wireincluding an end bonded to the second LED chip; a fifth lead including afifth wire bonding portion to which another end of the second additionalwire is bonded and also including a fifth mounting terminal surface forsurface mounting; a third wire including an end bonded to the third LEDchip; and a sixth lead including a sixth wire bonding portion to whichanother end of the third wire is bonded and also including a sixthmounting terminal surface for surface mounting. The first through sixthmounting terminal surfaces are flush with each other.

According to a ninth aspect of the present invention, in the LED moduleof the eighth aspect, the case is provided with a recess, and the firstthrough sixth leads include surfaces opposite to the first through thesixth mounting terminal surfaces, respectively. The recess of the caseis configured to expose at least a part of each of the opposite surfacesof of the first through the sixth leads, as viewed from a side oppositeto a direction in which the first through the sixth mounting terminalsurfaces face.

According to a tenth aspect of the present invention, in the LED moduleof any one of the first through ninth aspects, the case is provided witha reflector surrounding the first through third LED chips.

According to an eleventh aspect of the present invention, in the LEDmodule of the tenth aspect, the reflector surrounds a region filled withlight-transmitting resin covering the first through third LED chips.

Other features and advantages of the present invention will become moreapparent from detailed description given below with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a front view of an example of LED module according to thepresent invention;

FIG. 2 is a sectional view taken along lines II-II in FIG. 1;

FIG. 3 is a plan view of the example of the LED module according to thepresent invention;

FIG. 4 is a bottom view of the example of the LED module according tothe present invention;

FIG. 5 is a rear view of the example of the LED module according to thepresent invention;

FIG. 6 is a schematic sectional view showing a groove of the LED moduleaccording to the present invention; and

FIG. 7 is a front view of an example of conventional LED module.

MODE FOR CARRYING OUT THE INVENTION

Preferred embodiments of the present invention are described below withreference to the accompanying drawings.

FIGS. 1-6 show an example of LED module according to the presentinvention. The LED module 100 of this embodiment includes a case 10, LEDchips 21, 22 and 23, leads 31, 32, 33, 34, 35 and 36, Zener diodes 41and 42, wires 51, 52, 53, 54, 55, 56 and 57, and light-transmittingresin 60. The LED module 100 is configured as a side-view type thatemits light mainly in the direction z, and its dimensions are e.g. about6.9 mm in the direction x, about 2.15 mm in the direction y and about2.2 mm in the direction z. The LED module 100 is made by insert molding.Note that illustration of the light-transmitting resin 60 is omitted inFIG. 1.

The case 100 provides the base of the LED module 100 and is made of e.g.white resin. The case has a reflector 11 and a recess 12. The reflector11 surrounds the LED chips 21, 22 and 23. Light emitted from the LEDchips 21, 22 and 23 in the direction x and the direction y is reflectedby the reflector to travel in the direction z. The region surrounded bythe reflector 11 has dimensions of about 5.4 mm in the direction x andabout 1.6 mm in the direction y. As shown in FIGS. 3-5, the recess 12 isprovided on a side of the case 10 opposite to the light-emitting side inthe direction y. The recess 12 has a uniform cross section as viewed inthe direction z. The cross sectional shape is generally a flattrapezoid, elongated in the direction x.

The LED chips 21, 22 and 23 are the light source of the LED module 100.The LED chip 21 corresponds to the first LED chip defined in the presentinvention. The LED chip 21 has a laminated structure made up of ann-type semiconductor layer mainly composed of e.g. GaN, an active layerand a p-type semiconductor layer and emits blue light. The LED chip 22corresponds to the second LED chip defined in the present invention. TheLED chip 22 has a laminated structure made up of an n-type semiconductorlayer mainly composed of e.g. GaN, an active layer and a p-typesemiconductor layer and emits green light. The LED chip 23 correspondsto the third LED chip defined in the present invention. The LED chip 23has a laminated structure made up of an n-type semiconductor layermainly composed of e.g. Al, GaAs or GaAsP, an active layer and a p-typesemiconductor layer and emits red light. In this embodiment, the LEDchips 21 and 22 are configured as a two-wire type, whereas the LED chip23 is configured as a single-wire type.

The Zener diodes 41 and 42 prevent application of excessive reversevoltage to the LED chips 21 and 22, respectively, and allow current toflow in a reverse direction only when an excessive reverse voltage abovea certain value is applied.

The leads 31, 32, 33, 34, 35 and 36 serve to support the LED chips 21,22, 23 and supply electric power. Each of the leads may comprise a platemade of e.g. an alloy of Cu or Ni plated with Ag. Each lead 31, 32, 33,34, 35, 36 is partially covered by the case 10, and the remainingportion is exposed out of the case 10.

The lead 31 corresponds to the first lead defined in the presentinvention and includes a bonding portion 31 a, a wire bonding portion 31b, a groove 31 c and a mounting terminal surface 31 d. As shown in FIG.1, the bonding portion 31 a, the wire bonding portion 31 b and thegroove 31 c are arranged in the region surrounded by the reflector 11 ata position shifted slightly to the left from the center in the directionx.

To the bonding portion 31 a is die-bonded the LED chip 21. The wirebonding portion 31 b is on the left side of the bonding portion 31 a inthe direction x. To this wire bonding portion are bonded an end of thewire 51 and an end of the wire 56. The other end of the wire 51 isbonded to the LED chip 21. The other end of the wire 56 is bonded to theZener diode 41. The groove 31 c is positioned between the bondingportion 31 a and the wire bonding portion 31 b. The groove 31 c extendsin the direction y as shown in FIG. 1 and has e.g. a triangularcross-sectional shape as shown in FIG. 6.

Of the lead 31, the portion projecting from the case 10 downward in thedirection y in FIG. 1 is bent to extend in the direction z, as shown inFIGS. 1, 2, 4 and 5. Of this portion, the surface that faces downward inthe direction y in FIG. 1 is the mounting terminal surface 31 d. Thebent portion extends to overlap the recess 12 of the case 10 in thedirection z.

The lead 32 corresponds to the second lead defined in the presentinvention and includes a bonding portion 32 a, a wire bonding portion 32b, a groove 32 c and a mounting terminal surface 32 d. As shown in FIG.1, the shape of the lead 32 is symmetrical with the lead 31 with respectto an axis extending in the direction y. The bonding portion 32 a, thewire bonding portion 32 b and the groove 32 c are arranged in the regionsurrounded by the reflector 11 at a position shifted slightly to theright from the center in the direction x.

To the bonding portion 32 a is die-bonded the LED chip 22. The wirebonding portion 32 b is on the right side of the bonding portion 32 a inthe direction x. To this wire bonding portion are bonded an end of thewire 52 and an end of the wire 57. The other end of the wire 52 isbonded to the LED chip 22. The other end of the wire 57 is bonded to theZener diode 42. The groove 32 c is positioned between the bondingportion 32 a and the wire bonding portion 32 b. The shape and size ofthe groove 32 c are the same as those of the groove 31 c.

Of the lead 32, the portion projecting from the case 10 downward in thedirection y in FIG. 1 is bent to extend in the direction z, as shown inFIGS. 1, 2, 4 and 5. Of this portion, the surface that faces downward inthe direction y in FIG. 1 is the mounting terminal surface 32 d. Thebent portion extends to overlap the recess 12 of the case 10 in thedirection z.

The lead 33 corresponds to the third lead defined in the presentinvention and includes a bonding portion 33 a, a detour portion 33 e anda mounting terminal surface 33 d. As shown in FIG. 1, the bondingportion 33 a is arranged at the center in the direction x in the regionsurrounded by the reflector 11. Also, the bonding portion 33 a is at anupper position relative to the bonding portions 31 a and 32 a in thedirection y in FIG. 1. To the bonding portion 33 a is bonded the LEDchip 23 via a conductive material.

The detour portion 33 e includes a portion extending in the direction xfrom the bonding portion 33 a to both sides, and portions extending inthe direction y. The two ends of the detour portion 33 e, which arespaced apart from each other in the direction x, are on the outer sideof the corresponding two ends of the reflector 11 that are spaced apartin the direction x. Of the lead 33, two portions extending from thedetour portion 33 e project downward from the case 10 in the direction yin the figure. These portions are bent to extend in the direction asshown in FIGS. 1, 2, 4 and 5. Of these portions, the surfaces that facedownward in the direction y in FIG. 1 are the mounting terminal surfaces33 d. Thus, the LED module of this embodiment has two mounting terminalsurfaces 33 d that are spaced apart from each other in the direction x.As shown in FIG. 3, both of the bent portions project from the case 10in the direction x, as viewed in the direction z.

The lead 34 corresponds to the fourth lead of the present invention andincludes a bonding portion 34 a, a wire bonding portion 34 b, and amounting terminal surface 34 d. As shown in FIG. 1, the bonding portion34 a and the wire bonding portion 34 b are arranged in the regionsurrounded by the reflector 11 at a position shifted further to the leftin the figure than the lead 31 in the direction x.

To the bonding portion 34 a is bonded the Zener diode 41 via aconductive material. The wire bonding portion 34 b is on the right sideof the bonding portion 34 a in the direction x and arranged side by sidewith the wire bonding portion 31 b of the lead 31 in the direction y. Tothe wire bonding portion 34 b is bonded an end of the wire 54. The otherend of the wire 54 is bonded to the LED chip 21.

Of the lead 34, the portion projecting from the case 10 downward in thedirection y in FIG. 1 is bent to extend in the direction z, as shown inFIGS. 1, 2, 4 and 5. Of this portion, the surface that faces downward inthe direction y in FIG. 1 is the mounting terminal surface 34 d. Thebent portion extends to overlap the recess 12 of the case 10 in thedirection z.

The lead 35 corresponds to the fifth lead defined in the presentinvention and includes a bonding portion 35 a, a wire bonding portion 35b, and a mounting terminal surface 35 d. As shown in FIG. 1, the shapeof the lead 35 is symmetrical with the lead 34 with respect to an axisextending in the direction y. The bonding portion 35 a and the wirebonding portion 35 b are arranged in the region surrounded by thereflector 11 at a position shifted further to the right in the figurethan the lead 32 in the direction x.

To the bonding portion 35 a is bonded the Zener diode 42 via aconductive material. The wire bonding portion 35 b is on the left sideof the bonding portion 35 a in the direction x and arranged side by sidewith the wire bonding portion 32 b of the lead 32 in the direction y. Tothe wire bonding portion 35 b is bonded an end of the wire 55. The otherend of the wire 55 is bonded to the LED chip 22.

Of the lead 35, the portion projecting from the case 10 downward in thedirection y in FIG. 1 is bent to extend in the direction z, as shown inFIGS. 1, 2, 4 and 5. Of this portion, the surface that faces downward inthe direction y in FIG. 1 is the mounting terminal surface 35 d. Thebent portion extends to overlap the recess 12 of the case 10 in thedirection z.

The lead 36 corresponds to the sixth lead defined in the presentinvention, and includes a wire bonding portion 36 b and a mountingterminal surface 36 d. As shown in FIG. 1, the bonding portion 36 b isarranged at the center in the direction x in the region surrounded bythe reflector 11. Also, the bonding portion 36 b is at a lower positionrelative to the bonding portion 33 a in the direction y in FIG. 1. Tothe wire bonding portion 36 a is bonded an end of wire 53. The other endof the wire 53 is bonded to the LED chip 33.

The light-transmitting resin 60 fills the region surrounded by thereflector 11 and covers the LED chips 21, 22, 23 and the Zener diodes41, 42. The light-transmitting resin 60 is made of e.g. transparentsilicone resin.

Advantages of the LED module 100 are described below.

In this embodiment, the LED chips 21, 22 and 23 are arranged atpositions corresponding to three vertexes of a triangle. Thisarrangement allows the three LED chips 21, 22, 23 to be positionedrelatively close to each other, as compared with e.g. the case where theLED chips are arranged in a line. Thus, lights emitted from therespective LED chips can properly mix with each other, so that lightemission of a bright white color is obtained. Arranging the LED chip 23that emits red light at the center in the direction x promotes mixing ofred light, blue light and green light. Moreover, the LED module 100 canbe made compact by arranging the LED chips 21, 22, 23 close to eachother.

The provision of the mounting terminal surfaces 31 d, 32 d, 33 d, 34 d,35 d, 36 d allows individual operation of the LED chips 21, 22, 23.

The wire 53 extends from the LED chip 23 in the direction y beyond aline connecting the LED chips 21 and 22 to each other. Thus providedwire 53 hardly hinders the reduction of the distance between the LEDchips 21 and 22. This is advantageous for promoting the above-describedmixing of light and size reduction of the LED module 100.

The wires 51, 52, 54 and 55 are configured to extend away from the LEDchip 23 in the direction x. Thus, though the LED chips 21 and 22 are ofa two-wire type, no wires 51, 52, 54, 55 exist in the region surroundedby the LED chips 21, 22 and 23. This allows reduction of the distanceamong the LED chips 21, 22, 23. Employing a single-wire type LED chip asthe LED chip 23 reduces the number of the wires existing in the regionsurrounded by the LED chip 21, 22 and 23.

The bonding portion 33 a is arranged on the opposite side from a circuitboard upon which the module is mounted. The mounting terminal surfaces33 d are spaced apart from the bonding portion in the direction y. Inspite of this, the detour portion 33 e connects the bonding portion 33 aand each of the mounting terminal surfaces 33 d properly, andsubstantially with no hindrance to possible arrangements of the leads31, 32, 34, 35, 36. Advantageously, the LED module 100 can be maderelatively compact in spite of the provision of a large number ofmounting terminal surfaces 31 d, 32 d, 33 d, 34 d, 35 d and 36 d.

As shown in FIG. 6, the groove 31 c functions to stop the flow of thebonding material for die-bonding the LED chip 21. Thus, the bondingmaterial is prevented from flowing from the bonding portion 31 a to thewire bonding portion 31 b, which allows the bonding portion 31 a and thewire bonding portion 31 b to be arranged closer to each other. This isdesirable for the size reduction of the LED module 100. The groove 32 csimilarly contributes to the size reduction of the LED module 100.

As shown in FIG. 3, owing to the provision of the recess 12, therespective reverse surfaces of the mounting terminal surfaces 31 d, 32d, 34 d, 35 d, 36 d of the leads 31, 32, 34, 35, 36 are exposed. Forinstance, after the LED module 100 is mounted on a circuit board or thelike, some of the LED chips 21, 22, 23 may be found to be inoperable dueto poor soldering. Even in such a case, since the above-describedreverse surfaces are exposed, it is possible to conduct an operation forcoping with the fault, such as applying a soldering iron to the poorjoint portion. The projection of the reverse surfaces of the mountingterminal surfaces 33 d of the lead 33 from the case 10 to each side inthe direction x also allows a similar operation to be conducted.

The LED module according to the present invention is not limited to theforegoing embodiment. The specific structure of each part of the LEDmodule according to the present invention can be varied in design inmany ways.

Although the provision of the LED chip 21 that emits blue light, the LEDchip 22 that emits green light and the LED chip 23 that emits red lightis desirable in order for the LED module 100 to emit white light, thepresent invention is not limited to this, and LED chips that emit lightof different wavelengths can be employed.

The invention claimed is:
 1. An LED module comprising: a first lead anda second lead spaced apart from each other; a support member supportingand exposing the first lead and the second lead; an LED chip disposed onthe first lead; and a diode disposed on the second lead, wherein thesecond lead includes a first side edge, a second side edge, and a thirdside edge, the second side edge being parallel to the first side edgeand facing a side of the first lead, and the third side edge connectingthe first side edge and the second side edge, the first lead includes aprojecting portion facing the second side edge of the second lead, theprojecting portion being spaced apart from the second side edge of thesecond lead in a first direction, the first side edge and the secondside edge extending in a second direction perpendicular to the firstdirection, the projecting portion including a side edge that is locatedbetween the first side edge and the second side edge in the firstdirection, the LED module comprises a first wire bonded to the diode andto the projecting portion of the first lead, and the first wire extendsacross the second side edge of the second lead and the side edge of theprojecting portion of the first lead as viewed in a third direction thatis perpendicular to the first direction and to the second direction. 2.The LED module of claim 1, wherein the first lead includes a fourth sideedge that is connected to the projecting portion and that faces thefirst side edge of the second lead.
 3. The LED module of claim 2,wherein the fourth side edge of the first lead is parallel to the firstside edge of the second lead.
 4. The LED module of claim 1, wherein thefirst wire includes an end that is bonded at a position of theprojecting portion of the first lead.
 5. The LED module of claim 4,wherein the first side edge of the second lead is spaced apart from thefourth side edge of the first lead in a first direction, the first sideedge of the second lead extends in a second direction perpendicular tothe first direction, and the position of the projecting portion of thefirst lead is located between the diode and the LED chip in the firstdirection.
 6. The LED module of claim 5, wherein the first wire extendsdiagonally relative to the first direction as viewed in the thirddirection.
 7. The LED module of claim 1, further comprising a secondwire bonded to the LED chip and the first lead.
 8. The LED module ofclaim 7, wherein the first wire and the second wire extend in directionsdifferent from each other as viewed in the third direction.
 9. The LEDmodule of claim 7, further comprising a third wire including a first endand a second end, the first end of the third wire being bonded to theLED chip, and the second end of the third wire being located at aposition overlapping the second lead as viewed in the third direction.10. The LED module of claim 1, wherein the support member comprises areflector surrounding the LED chip as viewed in the third direction. 11.The LED module of claim 10, further comprising light-transmitting resintransmitting light from the LED chip and covering the LED chip and thediode, the reflector surrounding the light-transmitting resin as viewedin the third direction.
 12. The LED module of claim 1, wherein the firstlead includes a first exposed surface that is exposed from the supportmember, and the second lead includes a second exposed surface that isexposed from the support member, and the LED chip is disposed on thefirst exposed surface of the first lead, and the diode is disposed onthe second exposed surface of the second lead.